Upcoming Training Sessions organized by ChipIN Centre for Participating Institutions under C2S Programme
# | TOPIC | SESSION DETAILS | PRESENTER | DATE | NO. OF ATTENDEES | FEEDBACK |
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1 | Online Interactive Session on Solvnet Helpdesk by Synopsys Team- Reg. |
The Session will cover the following topic's:
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Synopsys Team | To be announced | ||
2 | Online Session on extraction of layers for the Die GDS package bonding by SCL Team - Reg |
The Session will cover Extraction of layers for the Die GDS package bonding | SCL Team | 1-Aug-2025 |
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3 | Technical (Online) Session on Post-Silicon Validation, Characterization, Testing, and Packaging Services by Tessolve for C2S Participants |
The Session will cover the following topics:
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Tessolve Team | 5-Aug-2025 |
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4 | Smarter Semiconductor Validation to Production: A Platform Approach with Emerson T&M |
The Session will cover the following topics:
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Emerson T&M | 7-Aug-2025 |
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5 | Online Webinar Series Engineering Tomorrow: Launch your Semiconductor Career with Siemens EDA |
The Session will cover the following topics: Session-1: Inauguration of Webinar Series
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Siemens Team | 11-Aug-2025 |
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6 | Technical Online Session on IC Packaging: Trends & Challenges by Cadence Team |
The Session details will be shared shortly |
Cadence Team | 14-Aug-2025 |
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7 | Beyond VLSI -Unveiling the Critical Role of PCB and IC Package Design in Modern Electronics |
This Session provides a foundational understanding of IC Packaging and PCB Design.
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Siemens Team | 18-Aug-2025 |
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8 | Technical (Online) Session on Design. Verify. Innovate: Discover the Power of Analog Design |
This Session covers a high-level understanding on Analog IP design flow right from designing transistor level schematics, enabling accurate circuit behaviour analysis, verification, and optimization before fabrication using industry standard EDA tools. |
Siemens Team | 25-Aug-2025 |
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9 | Technical (Online) Session on Fusion Compiler Session by Synopsys Team |
The Session will cover the following topics:
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Synopsys Team | 28-Aug-2025 |
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